An Overview of Advanced Electronic Packaging Technology. . 2.1 Recent Trends in Advanced Electronic Packaging . forcing the semiconductor manufacturers to compromise their chip .
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Advanced packaging systems, such as those based on AITC and ClO2 antimicrobials, are expected to experience significant growth because they are ideal vehicles for the delivery of antimicrobial agents to the surface, where postprocess contamination is most likely to occur.
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Electronic packages require advanced thermally conductive materials in heat . cently has it been applied in electronic packaging. HOPG is a highly anisotropic, rather brittle and weak material, with an inplane thermal conduc- . supplies for trains, wind turbine generators, and hybrid vehicles.
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Advanced Electronic Packaging Second Edition Edited by Richard K. Ulrich William D. Brown IEEE Press Series on Microelectronic Systems STUART K. …
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Advanced Electronic Packaging The Assurance Challenges National Aeronautics and Space Administration .nasa October 15, 2013 Michael J. Sampson